Board-mounted electronic components are cooled quickly and conveniently for troubleshooting with aid of device that produces cold jet of dry oxygen. It can cool nonflat and hard-to-reach components.


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    Titel :

    Localized cooling of electronic components


    Erschienen in:

    Erscheinungsdatum :

    01.03.1979



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


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    Freier Zugriff

    Energy Efficiency Impact of Localized Cooling

    Ghosh, Debashis / Wolfe, Edward / Bozeman, Jeffrey et al. | SAE Technical Papers | 2014