Process, using fast-setting putty-type thixotropic epoxy material, eliminates need for leakproof enclosures. Method reduces cure time from 15 to 4 hours. Epoxy masters are stronger and do not require special coating for storage. Manufacturers of form-fitted insulation or packaging forms will find this process to be of interest.
Match-mold process for foam insulation
NASA Tech Briefs ; 3 , 1
1978-06-01
Sonstige
Keine Angabe
Englisch
NTRS | 1986
|NTRS | 1989
|Molded foam, method for manufacturing molded foam, mold and method for manufacturing mold
Europäisches Patentamt | 2021
|MOLDED FOAM, METHOD FOR MANUFACTURING MOLDED FOAM, MOLD AND METHOD FOR MANUFACTURING MOLD
Europäisches Patentamt | 2019
|