Laser scribing eliminates microcracking at scribe line intersections, minimizes or eliminates preparation of scribe channels, and increases yield during the breaking process. Rapid overlapping of spots in the form of a line permits scribing speeds of 1.5 to 2.5 in./sec at 50 pulses/sec.


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    Titel :

    Laser scribing of silicon wafers


    Beteiligte:
    Calihan, C. (Autor:in)

    Erscheinungsdatum :

    01.10.1970


    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch




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