The Report covers the development of reliable electronic assemblies for spacecraft. The basic details of the hermetic, integral substrate, ceramic package are described, together with the handling and use of the thick film and active and passive devices. The qualification of the system for two UK satellite programs and its successful performance are discussed.


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    Titel :

    Multichip Integrated Circuits in UK Spacecraft


    Beteiligte:
    D. W. Allen (Autor:in) / J. A. C. Beattie (Autor:in) / P. Clarkson (Autor:in)

    Erscheinungsdatum :

    1975


    Format / Umfang :

    33 pages


    Medientyp :

    Report


    Format :

    Keine Angabe


    Sprache :

    Englisch




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