Using water to reduce the redeposition of ablation debris, high precision holes, with diameter of 4 /spl mu/m and depth over 200 /spl mu/m, were drilled from the rear surface of silica glass with infrared femtosecond laser pulses. The long holes with very small diameters had a well-defined wall without obvious taper.


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    Titel :

    Hole drilling of silica glass with infrared femtosecond laser pulses


    Beteiligte:
    Yan Li, (Autor:in) / Itoh, K. (Autor:in) / Watanabe, W. (Autor:in)


    Erscheinungsdatum :

    01.01.2001


    Format / Umfang :

    194929 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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