Using water to reduce the redeposition of ablation debris, high precision holes, with diameter of 4 /spl mu/m and depth over 200 /spl mu/m, were drilled from the rear surface of silica glass with infrared femtosecond laser pulses. The long holes with very small diameters had a well-defined wall without obvious taper.
Hole drilling of silica glass with infrared femtosecond laser pulses
01.01.2001
194929 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Hole Drilling of Silica Glass with Infrared Femtosecond Laser Pulses
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