The author describes a technique for automated inspection of solder bumps by analyzing spatial features and intensity characteristics of image highlights. It is based on high-contrast imaging of specular soldered surfaces against a reflective background using dark-field illumination for selective enhancement of surface topography. Bright-field images of these surfaces are also analyzed to resolve ambiguities in the defect-identification process. The reflectance of solder is studied, for the estimation of corresponding signatures of image specularities, which provide information about surface curvature, metallurgical constituents and topographic discontinuities. During inspection, a specular highlight in the run-time image is mapped into a feature space of reduced dimensionalities for comparison against the features of typical signatures. Based on this principle, visual inspection systems have been designed and implemented for high-speed detection of defective solder bumps and leadless ceramic chip carriers and metallized advanced VLSI wafers.<>


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    Titel :

    Automated inspection of solder bumps using visual signatures of specular image-highlights


    Beteiligte:
    Ray, R. (Autor:in)


    Erscheinungsdatum :

    01.01.1989


    Format / Umfang :

    707863 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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