This paper describes the design and analysis of a system for removing up to 10 kW of heat from each Power Electronics Building Block (PEBB) in a stack of four PEBB units, using liquid cooling via a dry interface. This is achieved by hard-mounting cold plates in the electronics cabinet, placing the heat-transfer surface of each PEBB adjacent to a cold plate, and improving heat transfer across the interface through the use of a thermal pad. The paper presents initial thermal analysis using analytical models. These analyses indicate that this is a viable solution to the PEBB cooling problem.


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    Titel :

    Preliminary Investigation into Liquid-Cooled PEBBs


    Beteiligte:
    Padilla, J. (Autor:in) / Chalfant, J. S. (Autor:in) / Chryssostomidis, C. (Autor:in) / Cooke, C. M. (Autor:in)


    Erscheinungsdatum :

    2021-08-03


    Format / Umfang :

    871036 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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