The need for ship system level models for assessing the benefits of high temperature superconducting (HTS) technology is articulated. The development of ship designs with HTS power cables using Smart Ship Systems Design (S3D) showed the need for new components such as the cable terminations that serve multiple HTS cables at the nodes. Conceptual designs of such multi-cable terminations are discussed. Results of the investigations of several alternative thermal insulation systems for HTS cables are discussed in the context of reducing the mass, size, and complexity as well as increasing the resiliency of the shipboard integrated power system. Design considerations for gaseous helium HTS power devices are discussed.


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    Titel :

    Component Model Development for Ship-Level Impact of High Temperature Superconducting Power Cables


    Beteiligte:
    Kim, Chul H. (Autor:in) / Leonard, Isaac (Autor:in) / Cheetham, Peter (Autor:in) / Ordonez, Juan (Autor:in) / Kephart, Jacob T. (Autor:in) / Miller, Jason D. (Autor:in) / Pamidi, Sastry V. (Autor:in)


    Erscheinungsdatum :

    01.08.2019


    Format / Umfang :

    1418150 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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