Summary form only given. Modules which implement high-density parallel free-space board-to-board optical interconnections have been constructed with linear arrays of components. These free-space optical interconnections provide the capability for dense z-axis interconnections perpendicular to boards or multichip modules. Each parallel interconnection contains an edge-emitting InGaAs laser array, transmitter and receiver lens arrays, and an InGaAs detector array flip-chip attached to a GaAs heterojunction bipolar transistor amplifier array.


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    Titel :

    High-speed high-density parallel free-space optical interconnections


    Beteiligte:
    Tsang, D.Z. (Autor:in) / Roussell, H.V. (Autor:in) / Woodhouse, J.D. (Autor:in) / Donnelly, J.P. (Autor:in) / Wang, C.A. (Autor:in) / Spears, D.L. (Autor:in) / Bailey, R.J. (Autor:in) / Mull, D.E. (Autor:in) / Pedrotti, K.D. (Autor:in) / Seabury, C.W. (Autor:in)

    Erschienen in:

    Proceedings of LEOS'94 ; 1 ; 217-218 vol.1


    Erscheinungsdatum :

    01.01.1994


    Format / Umfang :

    181850 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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