In this paper we focus on the heterogeneous integration of III-V opto-electronic devices and ultracompact SOI waveguides. The bonding coupling scheme of III-V and SOI is proposed. The first design is based on a thin film spin-on glass (SOG) adhesive bonding layer. Bonding layer thickness below 0.5 /spl mu/m have been presented. The second design is based on a thick film benzocyclobutene bonding (BCB). Bonding layer thickness above 1 /spl mu/m is readily achievable.
Heterogeneous integration of III-V membrane devices and ultracompact SOI waveguides
01.01.2004
209622 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
MB3.4 Heterogeneous Integration of III-V Membrane Devices and Ultracompact SOI Waveguides
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