The growth of wireless communications devices increased the needs for higher performance and higher density components. RFIC and packaging provides low cost solution to the future products. The quality of the interconnects connections determines the performance. This paper introduces a technique developed at National Instrument to boost the quality of the connections. The technique is based on Hot Vias interconnects for 60 GHz MMICs using silver epoxy with minimum added cost for the manufacturing process.


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    Titel :

    Robust Hot Via Interconnect Technique with Silver Epoxy for GaAs MMIC


    Beteiligte:


    Erscheinungsdatum :

    16.08.2021


    Format / Umfang :

    968478 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    The GaAs MMIC Reliability Assurance Program

    Kayali, S. / Ponchak, G. / Shaw, R. | NTRS | 1996


    A Realization of GaAs MMIC Tunable Active Bandpass Filter

    Tian, T. / Luo, J. / Li, Z. et al | British Library Online Contents | 1998


    Practical Method for Obtaining Maximum Channel Temperature of GaAs MMIC

    Kwak, Changsoo / Ahn, Ki Burm / Chang, Dongpil et al. | AIAA | 2007


    GaAs interconnect design and weld technology

    Arnold, J.H. jun. / Mardesich, N. / Smith, B.S. | Tema Archiv | 1985