The growth of wireless communications devices increased the needs for higher performance and higher density components. RFIC and packaging provides low cost solution to the future products. The quality of the interconnects connections determines the performance. This paper introduces a technique developed at National Instrument to boost the quality of the connections. The technique is based on Hot Vias interconnects for 60 GHz MMICs using silver epoxy with minimum added cost for the manufacturing process.
Robust Hot Via Interconnect Technique with Silver Epoxy for GaAs MMIC
16.08.2021
968478 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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