The device designs used for this work are based on highly efficient vertical-cavity surface emitting lasers, connected to corresponding photoreceivers. In order to meet the constraints of packaging, the optical system used in the design is implemented by the integration of microlenses into the laser and photoreceiver substrates.


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    Titel :

    Photonics for Z-axis stacking of multi-chip modules


    Beteiligte:
    Carson, R.F. (Autor:in) / Lovejoy, M.L. (Autor:in) / Lear, K.L. (Autor:in) / Warren, M.E. (Autor:in) / Blum, O. (Autor:in) / Seigal, P.K. (Autor:in) / Craft, D.C. (Autor:in) / Kilcoyne, S.P. (Autor:in) / Patrizi, G.A. (Autor:in)


    Erscheinungsdatum :

    01.01.1995


    Format / Umfang :

    186318 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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