The device designs used for this work are based on highly efficient vertical-cavity surface emitting lasers, connected to corresponding photoreceivers. In order to meet the constraints of packaging, the optical system used in the design is implemented by the integration of microlenses into the laser and photoreceiver substrates.
Photonics for Z-axis stacking of multi-chip modules
01.01.1995
186318 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Photonics for Z-Axis Stacking of Multi-Chip Modules
British Library Conference Proceedings | 1995
|Online Contents | 1993
|Flip chip technology for multi chip modules
Tema Archiv | 1997
|Multi-Chip Modules for Automotive Applications
SAE Technical Papers | 1993
|Espros Photonics: Chip-Fabrik im Schweizer Bergesinneren
British Library Online Contents | 2007