Summary form only given. This talk summarizes current efforts in fusion bonding and the application of this technology to vertical-cavity surface-emitting lasers at Hewlett-Packard laboratories. We discuss electrical characteristics, carrier-concentration profiling and SIMS analyses through InP/GaAs junctions, and the development of 1300 nm VCSELs.
Fusion bonding for vertical cavity surface-emitting lasers
1998-01-01
215044 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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