In the FAST-Net approach the optical I/O from any single smart pixel array (SPA) chip, located at a lens' focal plane, are linked to portions of the I/O arrays of all chips in the system. To achieve this, clusters of VCSELs and photodetectors are imaged onto corresponding clusters on other chips. Multiple point-to-point links are established between cluster pairs on different SPAs. The clusters are interleaved to achieve a global interconnection pattern across the multi-chip plane, thus effecting a high-density bidirectional data path between every pair of SPA chips on the MCM. SPA chips with integrated VCSEL/detector arrays.
Design of a 160 Gbps free-space optical interconnection fabric for fully connected multi-chip applications
The 15th Annual Meeting of the IEEE Lasers and Electro-Optics Society ; 1 ; 61-62 vol.1
01.01.2002
229904 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
British Library Conference Proceedings | 2002
|High-density 300-Gbps/cm^2 parallel free-space optical interconnection design considerations
British Library Conference Proceedings | 1995
|High Speed Parallel Multi-chip Interconnection With Free Space Optics
British Library Conference Proceedings | 1999
|Free-space optical interconnection of 3D optoelectronic VLSI chip stacks [4292-13]
British Library Conference Proceedings | 2001
|