In the FAST-Net approach the optical I/O from any single smart pixel array (SPA) chip, located at a lens' focal plane, are linked to portions of the I/O arrays of all chips in the system. To achieve this, clusters of VCSELs and photodetectors are imaged onto corresponding clusters on other chips. Multiple point-to-point links are established between cluster pairs on different SPAs. The clusters are interleaved to achieve a global interconnection pattern across the multi-chip plane, thus effecting a high-density bidirectional data path between every pair of SPA chips on the MCM. SPA chips with integrated VCSEL/detector arrays.


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    Titel :

    Design of a 160 Gbps free-space optical interconnection fabric for fully connected multi-chip applications


    Beteiligte:
    Christensen, M.P. (Autor:in) / Milojkovic, P. (Autor:in) / Kuzniac, C. (Autor:in) / Haney, M.W. (Autor:in)


    Erscheinungsdatum :

    01.01.2002


    Format / Umfang :

    229904 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch





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