Summary form only given. Fused silica is an important material for optics and optoelectronics because of its excellent properties of transparency in a wide wavelength range and strong damage resistivity for laser irradiation. But these properties make it difficult to fabricate fused silica. The standard method to fabricate fused silica with a pattern below 100 /spl mu/m is lithography, which is a several-steps process. Although conventional excimer-laser ablation was established as a dry etch method, the fluence of ablation thresholds is too high. For example, 248-nm nanosecond-KrF-laser ablation needs the fluence higher than 20 J/cm/sup 2/. We developed a one-step technique to fabricate a well-defined micro-sized pattern of lines and spaces in fused silica, using laser induced backside wet etching.
One-step fabrication of optical materials by laser ablation of organic liquid
1999-01-01
172104 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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