The first phase of OETC (OETC-1) produced a parallel, 32-channel, high density (140 mm pitch), 500 Mb/s NRZ, point to point, optical data link. This link has a 32 channel VCSEL array operating at 850 nm and a 32 channel MCM receiver array. The key packaging technologies include the silicon optical bench technology and a multichip module technology. The transmitter and receiver parts were directly connected (no pigtails) using MACII-32 connectors.


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    Titel :

    Applications of parallel optical interconnects


    Beteiligte:
    Grimes, G.J. (Autor:in) / Wong, Y.M. (Autor:in) / Anthony, P.J. (Autor:in) / Priest, E. (Autor:in) / Sherman, C.J. (Autor:in) / Peck, S.R. (Autor:in) / Holland, W.R. (Autor:in) / Muehler, D.J. (Autor:in) / Faudskar, C.C. (Autor:in) / Nyquist, J.S. (Autor:in)


    Erscheinungsdatum :

    01.01.1996


    Format / Umfang :

    422430 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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