Significant size, weight, power and reliability improvements can be achieved in next generation avionics by the modular integration of similar functions into a fault tolerant reconfigurable architecture. The Integrated Communication Navigation Identification Avionics program (ICNIA), and ITT/TI Joint Venture, is accomplishing this task with a combination of modular circuit designs using VHSIC technology, improved packaging designs incorporating surface mount component technology and a modular two-level maintenance support concept for reduced life cycle cost. This article will concentrate on the modular packaging technology of the digital processor subsystem.


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    Titel :

    Modular ICNIA Packaging Technology


    Beteiligte:


    Erscheinungsdatum :

    1987-06-01


    Format / Umfang :

    2576543 byte




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch