Significant size, weight, power and reliability improvements can be achieved in next generation avionics by the modular integration of similar functions into a fault tolerant reconfigurable architecture. The Integrated Communication Navigation Identification Avionics program (ICNIA), and ITT/TI Joint Venture, is accomplishing this task with a combination of modular circuit designs using VHSIC technology, improved packaging designs incorporating surface mount component technology and a modular two-level maintenance support concept for reduced life cycle cost. This article will concentrate on the modular packaging technology of the digital processor subsystem.
Modular ICNIA Packaging Technology
IEEE Aerospace and Electronic Systems Magazine ; 2 , 6 ; 20-23
1987-06-01
2576543 byte
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch