We present a plastic based 3-D MCM technology with a path for achieving ultra-high densities with abroad array of applications. This path has been chosen as a means for realizing novel next generation digital architectures. The 3D MCM is composed of layers of a plastic based MCM interconnected together with a z-axis conductive adhesive film. Each 2D MCM is fabricated with feed throughs which provide a connection from the top to the back side of the MCM. In this paper, we will demonstrate this new technology with a four layer 3D mechanical stack with a stack thickness of 1.2 mm and a Si density of 58 mm/sup 3//IC. We will also presented a path towards forming an ultra-thin 3D stack by reducing the thickness of the plastic substrate and the interconnect layer.
Towards an ultra-high density interconnect (UHDI) technology
01.01.1997
691975 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Towards an Ultra-High Density Interconnect (UHDI) Technology
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