We present a plastic based 3-D MCM technology with a path for achieving ultra-high densities with abroad array of applications. This path has been chosen as a means for realizing novel next generation digital architectures. The 3D MCM is composed of layers of a plastic based MCM interconnected together with a z-axis conductive adhesive film. Each 2D MCM is fabricated with feed throughs which provide a connection from the top to the back side of the MCM. In this paper, we will demonstrate this new technology with a four layer 3D mechanical stack with a stack thickness of 1.2 mm and a Si density of 58 mm/sup 3//IC. We will also presented a path towards forming an ultra-thin 3D stack by reducing the thickness of the plastic substrate and the interconnect layer.


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    Titel :

    Towards an ultra-high density interconnect (UHDI) technology


    Beteiligte:
    Krishnamurthy, V. (Autor:in) / Rose, J. (Autor:in) / Saia, R. (Autor:in) / Durocher, K. (Autor:in)


    Erscheinungsdatum :

    01.01.1997


    Format / Umfang :

    691975 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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