High-power diode lasers with an average output power of several 10 W and above are growing into key components for modern laser systems and applications in, e.g. materials processing and medicine. Solid state lasers strongly benefit from the higher laser beam quality, lifetime and reliability as well as from the lower energy consumption and floor space requirement which are possible if diode lasers are used instead of conventional lamps. In diode lasers for direct applications in, e.g. soldering and plastics welding most of these advantages even become more evident.


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    Titel :

    Packaging high-power diode laser bars using microchanneled copper mounts


    Beteiligte:
    Loosen, P. (Autor:in) / Ebert, T. (Autor:in) / Jandeleit, J. (Autor:in) / Treusch, G. (Autor:in)


    Erscheinungsdatum :

    01.01.1998


    Format / Umfang :

    173289 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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