Conventional IGBT modules with bonding wires have been suffered from relatively high thermal resistance from junction to case (Rthjc) due to unavoidable single-sided cooling (SSC), and also suffered from uneven current distribution due to unsymmetrical electrical interconnection. A novel IGBT package with double-sided cooling (DSC) geometry was proposed in this paper to overcome these problems. A comprehensive comparative study between the DSC geometry and the SSC geometry has been conducted by simulations. The analytical results demonstrate that the DSC geometry is well superior to the conventional SSC geometry in both electrical and thermal behavior, which predicts a brighter future in various key applications for this emerging package.


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    Titel :

    Design & analysis of a novel IGBT package with double-sided cooling


    Beteiligte:
    Zhong, Yulin (Autor:in) / Meng, Jinlei (Autor:in) / Ning, Puqi (Autor:in) / Wen, Xuhui (Autor:in)


    Erscheinungsdatum :

    01.08.2014


    Format / Umfang :

    1210298 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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