An apparatus for fabricating a stack of adhesive plies for attaching a doubler to a surface on a structure includes a digital scanner, configured for scanning the surface and for producing a first set of digital data representing a contour of the surface, and a computer, coupled to the digital scanner, having a processor and system memory. The computer is programmed for mapping a gap between a bonding surface on the doubler and the surface on the structure using the first set of digital data and a second set of digital data representing the bonding surface, and for segmenting the mapped gap into layers corresponding to the adhesive plies.
Fitting doublers using gap mapping
2018-06-12
Patent
Elektronische Ressource
Englisch
IPC: | B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B29L INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES , Index-Schema für besondere Gegenstände in Verbindung mit Unterklasse B29C / B64F GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLY ADAPTED FOR USE IN CONNECTION WITH AIRCRAFT , Boden- oder Flugzeugträgerdeckeinrichtungen besonders ausgebildet für die Verwendung in Verbindung mit Luftfahrzeugen / G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS , Messen der Länge, der Dicke oder ähnlicher linearer Abmessungen |
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