An apparatus for fabricating a stack of adhesive plies for attaching a doubler to a surface on a structure includes a digital scanner, configured for scanning the surface and for producing a first set of digital data representing a contour of the surface, and a computer, coupled to the digital scanner, having a processor and system memory. The computer is programmed for mapping a gap between a bonding surface on the doubler and the surface on the structure using the first set of digital data and a second set of digital data representing the bonding surface, and for segmenting the mapped gap into layers corresponding to the adhesive plies.
Fitting doublers using gap mapping
12.06.2018
Patent
Elektronische Ressource
Englisch
IPC: | B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B29L INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES , Index-Schema für besondere Gegenstände in Verbindung mit Unterklasse B29C / B64F GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLY ADAPTED FOR USE IN CONNECTION WITH AIRCRAFT , Boden- oder Flugzeugträgerdeckeinrichtungen besonders ausgebildet für die Verwendung in Verbindung mit Luftfahrzeugen / G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS , Messen der Länge, der Dicke oder ähnlicher linearer Abmessungen |
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