A module includes a first partial housing and a second partial housing, wherein the first partial housing and the second partial housing together form a recess, a circuit board disposed in the recess; and an encapsulation mass, which closes the recess. A material from which the first partial housing is manufactured and a material from which the second partial housing is manufactured have a difference in thermal expansion coefficients that is at most 10% of the largest value of the two thermal expansion coefficients, the first partial housing includes a sealing structure and the second partial housing includes a counter-sealing structure, and at least one of the sealing structure and the counter-sealing structure is configured to extend into the other of the sealing structure and the counter-sealing structure.
Module for a tire pressure monitoring system
2017-10-24
Patent
Elektronische Ressource
Englisch
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