An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the heat sink, thereby preserving an insulation gap between the back electrode and the heat sink. As a result, short-circuiting is prevented.


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    Titel :

    Electronic element and electronic device


    Beteiligte:
    KADOIKE YUTA (Autor:in) / KABUNE HIDEKI (Autor:in) / YAMAMOTO TOSHIHISA (Autor:in)

    Erscheinungsdatum :

    2017-09-05


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B62D MOTOR VEHICLES , Motorfahrzeuge



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