A modular assembly for a headlight includes at least one semiconductor light module having at least one semiconductor light source mounted on a cooling element, having at least one ball socket in which the semiconductor light module is mounted and configured to be pivoted about a ball socket center, a curved cup formed in the cooling element and configured to be mounted in the ball socket, and a guide shell arranged between the curved cup and the ball socket. A method for adjusting the semiconductor light module is also disclosed.
LED modules with ball joint adjustable support
02.05.2017
Patent
Elektronische Ressource
Englisch
IPC: | F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF , Funktionsmerkmale oder Einzelheiten von Leuchten oder Beleuchtungssystemen / F21S Ortsfeste Leuchten , NON-PORTABLE LIGHTING DEVICES / B60Q ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL , Anordnung von Signal- oder Beleuchtungsvorrichtungen, deren Einbau oder Halterung oder deren Schaltkreise bei Fahrzeugen allgemein |