The patent application discloses a capacitive micromachined ultrasound transducer, comprising a silicon substrate; a cavity; a first electrode, which is arranged between the silicon substrate and the cavity; wherein the first electrode is arranged under the cavity; a membrane, wherein the membrane is arranged above the cavity and opposite to the first electrode; a second electrode, wherein the second electrode is arranged above the cavity and opposite to the first electrode; wherein the second electrode is arranged in or close to the membrane, wherein the first electrode and the second electrode are adapted to be supplied by a voltage; and a first isolation layer, which is arranged between the first electrode and the second electrode, wherein the first isolation layer comprises a dielectric. It is also described a system for generating or detecting ultrasound waves, wherein the system comprises a transducer according to the patent application. Further, it is disclosed a method for manufacturing a transducer according to the patent application, wherein the transducer is manufactured with the help of a CMOS manufacturing process, wherein the transducer can be manufactured as a post-processing feature during a CMOS process.


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    Titel :

    Capacitive micromachined ultrasound transducer


    Beteiligte:

    Erscheinungsdatum :

    2017-01-10


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H02N Elektrische Maschinen, soweit nicht anderweitig vorgesehen , ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR / B06B GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL , Erzeugen oder Übertragen mechanischer Schwingungen allgemein / B60B VEHICLE WHEELS , Räder für Fahrzeuge



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