Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.


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    Titel :

    Transparent material processing with an ultrashort pulse laser


    Beteiligte:
    ARAI ALAN Y (Autor:in) / CHO GYU C (Autor:in) / XU JINGZHOU (Autor:in) / YOSHINO FUMIYO (Autor:in) / ZHANG HAIBIN (Autor:in) / BOVATSEK JAMES (Autor:in) / YOSHIDA MAKOTO (Autor:in)

    Erscheinungsdatum :

    2015-09-22


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B23K Löten , SOLDERING OR UNSOLDERING / B28D Bearbeiten von Stein oder steinähnlichen Werkstoffen , WORKING STONE OR STONE-LIKE MATERIALS / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B41J TYPEWRITERS , Schreibmaschinen / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT



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