A half-bridge package for a power inverter comprises a first switch and a first lead coupled to the first switch, and a second switch and a second lead coupled to the second switch, wherein the first lead and the second lead are adjacent to one another. At least one of the first switch and the second switch are formed on a die, and the half-bridge package may further comprise a thermistor mounted to the die. In some examples the thermistor is sintered to the die.


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    Titel :

    POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION


    Beteiligte:
    RAMM ROBERT (Autor:in) / MILIA JOSEPH (Autor:in)

    Erscheinungsdatum :

    05.06.2025


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B64C AEROPLANES , Flugzeuge / H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS , Anlagen zur Umformung von Wechselstrom in Wechselstrom, von Wechselstrom in Gleichstrom oder umgekehrt, oder von Gleichstrom in Gleichstrom und zur Verwendung in Netzen oder ähnlichen Stromversorgungssystemen / B64F GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLY ADAPTED FOR USE IN CONNECTION WITH AIRCRAFT , Boden- oder Flugzeugträgerdeckeinrichtungen besonders ausgebildet für die Verwendung in Verbindung mit Luftfahrzeugen



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    CONSOLIDATED ELECTRONICS PACKAGING

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