An apparatus comprising a satellite includes a first radiator panel on a first side of a central body of the satellite and a second radiator panel on a second side of the central body is provided. The first radiator panel is thermally attached to the second radiator panel. A third side of the central body is positioned between the first side and the second side. A fourth side of the central body is positioned between the first side and the second side, opposing the third side. The first radiator panel is thermally attached to the second radiator panel by one or more coupling heat pipes, the coupling heat pipes exposed to an exterior environment of the satellite.


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    Titel :

    RADIATING COUPLING HEAT PIPE


    Beteiligte:
    CHIANG JASON (Autor:in)

    Erscheinungsdatum :

    12.10.2023


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B64G Raumfahrt , COSMONAUTICS / F28D Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen , HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT



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