A planar power module includes a second substrate arranged parallel to a first substrate, with the substrates respectively having a dielectric layer interposed between two conductive layers, such that one of the conductive layers of each substrate together forms parallel external conductive surfaces of the power module. The power module includes direct current (DC) bus bars, alternating current (AC) bus bars, and semiconductor switching dies arranged between the substrates. The dies are electrically connected to the bus bars, with each respective die electrically connected to a conductive layers of the first or second substrates. A polymer molding material partially surrounds the substrates and the switching dies. An electric powertrain system includes an electric machine, a propulsion battery pack, and a traction power inverter module (TPIM) having the power module. The power module is a three-phase full-bridge inverter circuit. An electric powertrain and motor vehicle use the power module.


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    Titel :

    PLANAR POWER MODULE WITH HIGH POWER DENSITY PACKAGING


    Beteiligte:
    LIU MING (Autor:in) / COPPOLA ANTHONY M (Autor:in) / ALVI MUHAMMAD H (Autor:in)

    Erscheinungsdatum :

    2022-07-14


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



    Planar power module with high power density packaging

    LIU MING / COPPOLA ANTHONY M / ALVI MUHAMMAD H | Europäisches Patentamt | 2023

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