An automotive ornament, including a circuit board, a substrate, a light-emitting element, a surface decoration layer, and a pressure sensing element, is provided. The substrate is disposed on the circuit board. The light-emitting element is disposed between the circuit board and the substrate, and the light-emitting element is electrically connected to the circuit board. The surface decoration layer wraps the substrate. The surface decoration layer covers the pressure sensing element. The pressure sensing element is electrically connected to the light-emitting element through the circuit board, and pressure sensing of the pressure sensing element causes the light-emitting element to emit light, vibrate, or feedback sound.


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    Titel :

    AUTOMOTIVE ORNAMENT AND MANUFACTURING METHOD THEREOF


    Beteiligte:
    YU CHE-MING (Autor:in) / CHUANG WU CHUAN (Autor:in) / LEE SHUMING (Autor:in)

    Erscheinungsdatum :

    2022-03-31


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / B44F Besondere Musterungen oder Bilder , SPECIAL DESIGNS OR PICTURES / B60Q ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL , Anordnung von Signal- oder Beleuchtungsvorrichtungen, deren Einbau oder Halterung oder deren Schaltkreise bei Fahrzeugen allgemein



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