A photoelectric conversion apparatus includes a first chip having a first semiconductor element layer including a pixel region of a plurality of pixel circuits, and a second chip having a second semiconductor element layer. The first and second chips are bonded by a plurality of metal bonding portions between the first and second semiconductor element layers. The plurality of metal bonding portions includes first and second metal bonding portions disposed in a region overlapping with the pixel region in a plan view. The first metal bonding portion connects at least either one of the plurality of pixel circuits and the second semiconductor element layer. The second metal bonding portion is connected to at least either one of the plurality of pixel circuits and is not connected to the second semiconductor element layer in the region overlapping with the pixel region.


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    Titel :

    PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVING OBJECT


    Beteiligte:
    ONUKI YUSUKE (Autor:in)

    Erscheinungsdatum :

    2021-09-30


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B60W CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION , Gemeinsame Steuerung oder Regelung von Fahrzeug-Unteraggregaten verschiedenen Typs oder verschiedener Funktion / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES