The disclosure specifies an arrangement including a circuit carrier board on which is mounted at least one electrical/electronic component. At least one heat pipe is formed in the circuit carrier board. The disclosure also specifies a power converter including the arrangement, and an aircraft including a power converter.
COOLING ARRANGEMENT FOR ELECTRICAL COMPONENTS, CONVERTER WITH A COOLING ARRANGEMENT, AND AIRCRAFT HAVING A CONVERTER
20.05.2021
Patent
Elektronische Ressource
Englisch
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen / H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / B64C AEROPLANES , Flugzeuge / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / F28D Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen , HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT |
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