A module for accommodating electronic circuitry which advantageously is able to take advantage of air in a climate system for cooling of the electronic circuitry. In one aspect, there is provided a module for accommodating electronic circuitry in a vehicle, the module includes: at least one attachment surface for attachment of electronic circuitry thereon, an air guiding structure for receiving an air flow for cooling of the attachment surface, the air guiding structure having a wall member including the attachment surface such that the wall member provides a thermal path between the attachment surface and the air in the air guiding structure, wherein the air guiding structure includes an inlet configured to receive air for cooling of the attachment surface wherein the air flow is an air flow used for climate control in the vehicle.


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    Titel :

    MODULE FOR ACCOMMODATING AND COOLING ELECTRONIC CIRCUITRY IN A VEHICLE


    Beteiligte:

    Erscheinungsdatum :

    2021-05-13


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B60H ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING, OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODS SPACES OF VEHICLES , Anordnung oder Einbau der Heizung, Kühlung, Lüftung oder anderer Luftbehandlungsvorrichtungen für die Fahrzeugräume für Reisende oder Fracht / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES



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