The disclosed subject matter relates to a module (100) for accommodating electronic circuitry (104) in a vehicle, the module comprises: at least one attachment surface (102) for attachment of electronic circuitry thereon, an air guiding structure (106) for receiving an air flow for cooling of the attachment surface, the air guiding structure having a wall member (108) including the attachment surface such that the wall member provides a thermal path between the attachment surface and the air in the air guiding structure, wherein the air guiding structure includes an inlet (112) configured to receive air for cooling of the attachment surface wherein the air flow is an air flow used for climate control in the vehicle.
A MODULE FOR ACCOMODATING AND COOLING ELECTRONIC CIRCUITRY IN A VEHICLE
MODUL ZUR UNTERBRINGUNG UND KÜHLUNG VON ELEKTRONISCHEN SCHALTKREISEN IN EINEM FAHRZEUG
MODULE D'ACCUEIL ET DE REFROIDISSEMENT DE CIRCUITS ÉLECTRONIQUES DANS UN VÉHICULE
2021-05-12
Patent
Elektronische Ressource
Englisch
IPC: | B60H ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING, OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODS SPACES OF VEHICLES , Anordnung oder Einbau der Heizung, Kühlung, Lüftung oder anderer Luftbehandlungsvorrichtungen für die Fahrzeugräume für Reisende oder Fracht / B62D MOTOR VEHICLES , Motorfahrzeuge |
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