A system includes a programmable logic device (PLD) and a processor. The processor determines sets of power values associated with respective portions of a plurality of portions of the PLD. The processor also determines a temperature value for each portion of the plurality of portions based on the sets of power values and platform data associated with the PLD. Additionally, the processor generates a power map indicative of an expected amount of power for each portion of the plurality of portions based on the sets of power values. Furthermore, the processor generates a heat map indicative of an expected temperature value for each portion of the plurality of portions.


    Zugriff

    Download


    Exportieren, teilen und zitieren



    Titel :

    THERMAL MANAGEMENT OF INTEGRATED CIRCUITS


    Beteiligte:

    Erscheinungsdatum :

    2019-02-07


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60H ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING, OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODS SPACES OF VEHICLES , Anordnung oder Einbau der Heizung, Kühlung, Lüftung oder anderer Luftbehandlungsvorrichtungen für die Fahrzeugräume für Reisende oder Fracht



    Thermal management of integrated circuits

    HUTTON MICHAEL DAVID | Europäisches Patentamt | 2023

    Freier Zugriff

    Thermal management of integrated circuits

    HUTTON MICHAEL DAVID | Europäisches Patentamt | 2021

    Freier Zugriff

    THERMAL MANAGEMENT OF INTEGRATED CIRCUITS

    HUTTON MICHAEL DAVID | Europäisches Patentamt | 2022

    Freier Zugriff

    Integrated Circuits and Thermal Issues: A Primer

    Mitra, Atindra K. / Jones, Keith W. | SAE Technical Papers | 2003