A structural module assembly with conductive reinforcements overmolded within the plastic and/or composite subassembly as a main power bus and a communication bus for electrical components assembled onto the module. Control signals are either transmitted between a main microcontroller and another microcontroller by way of the communication bus or wirelessly. The microcontrollers determine which electrical components to activate, and power is provided to the electrical components by way of the main power bus.
STRUCTURAL MODULE ASSEMBLY HAVING OVERMOLDED ELECTRICALLY CONDUCTIVE REINFORCEMENTS
07.02.2019
Patent
Elektronische Ressource
Englisch
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