A semiconductor device is provided, the semiconductor device having: a semiconductor chip; a wiring substrate which supports the semiconductor chip and is electrically connected to the semiconductor chip; a first metal plate which supports the wiring substrate; a second metal plate which is arranged between the wiring substrate and the first metal plate; a first bonding part which bonds the wiring substrate and the second metal plate; and a second bonding part which bonds the first metal plate and the second metal plate, and having a thickness of an outer circumferential part of the second metal plate being larger than a thickness of a center part of the second metal plate.


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    Titel :

    SEMICONDUCTOR DEVICE AND POWER ELECTRONICS APPARATUS


    Beteiligte:
    MIYAZAKI TAKAAKI (Autor:in) / IKEDA OSAMU (Autor:in)

    Erscheinungsdatum :

    28.06.2018


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / B61C Lokomotiven , LOCOMOTIVES



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