The invention relates to methods of bonding and a conductively bonded joint, provided by high loadings of conductively coated nano scale particulate fillers in a conductive adhesive in combination with a conductive intermediary structure, more particularly to a lightning strike resilient bonded joint between fibre reinforced polymer composites. A method of joining a first fibre reinforced polymer composite surface and a second fibre reinforced polymer composite surface, comprising the steps of providing a conductive intermediary structure between said first and second surfaces, filling the void between said surfaces and enveloping said intermediary structure with a conductive adhesive, curing the conductive adhesive to form a bonded first and second surface. A conductive adhesive comprising a curable binder and a high aspect ratio nanoscale carbon particulate filler present in the range of from 0.1 to 40% wt, wherein said particulate filler comprises a metal coating.


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    Titel :

    CONDUCTIVE BONDED COMPOSITES


    Beteiligte:

    Erscheinungsdatum :

    2015-12-17


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    C09J ADHESIVES , Klebstoffe / B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / C08K Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe , USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS



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