An integrated mounting and cooling apparatus includes a housing body having a first mounting surface configured to receive electronic components to be cooled and a heat dissipation channel extending through the housing body under the first mounting surface. An array of cooling fins is disposed in the heat dissipation channel. The apparatus is configured to serve as a mounting surface for the electronic components, as a housing for the electronic components, and a heat-sink to cool the electronic components.


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    Titel :

    INTEGRATED MOUNTING AND COOLING APPARATUS, ELECTRONIC DEVICE, AND VEHICLE


    Beteiligte:
    BRINDAK ZACHARY (Autor:in) / YOUNG HENRY (Autor:in) / BROWN THEODORE (Autor:in) / CILLESSEN SEAN (Autor:in) / MURPHY MARK (Autor:in)

    Erscheinungsdatum :

    30.07.2015


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES



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