A power electronics converter includes a multi-layer planar carrier substrate and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element. Each power semiconductor switching element is included in a power semiconductor prepackage. One or more terminals of the power semiconductor switching element are connected to at least one conductive layer of the multi-layer planar carrier substrate at an electrical connection side of the power semiconductor prepackage. The electrical connection side is spaced apart in a z-direction from the carrier substrate by a prepackage gap. A peak rated power output of the power electronics converter is greater than or equal to 25 kW, and a converter parameter θ, which is defined as a size in the z-direction of the prepackage gap divided by a maximum electric field strength in the prepackage gap, is less than or equal to 300 pm2/V.


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    Titel :

    High voltage power converter


    Beteiligte:
    WALTRICH UWE (Autor:in) / BUCHERT STANLEY (Autor:in) / BOHLLÄNDER MARCO (Autor:in) / MÜLLER CLAUS (Autor:in)

    Erscheinungsdatum :

    11.02.2025


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen



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