A wiring module 20 is included in a power storage module 2 including a plurality of power storage elements 10 each having electrode terminals 11A and 11B and is connected to the power storage elements 10. The wiring module 20 includes a flexible FPC 21A including a first conductive path 23 and a circuit board 30 including a second conductive path that is electrically connected to the first conductive path 23. The FPC 21A includes a main body portion 24 and a circuit connecting portion 27 that extends from the main body portion 24 and is overlaid on the circuit board 30. The first conductive path 23 includes a first land 23A included in the circuit connecting portion 27. The second conductive path includes a second land 32A that is electrically connected to the first land 23A. The connected portion between the first land 23A and the second land 32A is covered by a covering portion 60 constituted by a resin having insulating properties.


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    Titel :

    Substrate connection structure and vehicle wiring module


    Beteiligte:
    MATSUMURA NOBUYUKI (Autor:in) / TAKASE SHINICHI (Autor:in) / SHIMODA HIROKI (Autor:in) / YANAGIDA TAIJI (Autor:in)

    Erscheinungsdatum :

    12.11.2024


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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