A semiconductor device includes: multiple semiconductor elements each having a one surface and a rear surface in a plate thickness direction; a first member that sandwiches the multiple semiconductor elements and is electrically connected to an electrode on the one surface; a second member electrically connected to an electrode on the rear surface; and multiple terminals that are continuous from the first or second member. An area of the second member is smaller than that of the first member. Semiconductor elements are arranged in a longitudinal direction of the second member. The semiconductor device further includes a first joint portion that electrically connects each semiconductor element and the second member and a second joint portion that electrically connects a terminal and the second member. The multiple solder joint portions are symmetrically placed.


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    Titel :

    Plurality of chips between two heat sinks


    Beteiligte:

    Erscheinungsdatum :

    14.11.2023


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H02P CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS , Steuern oder Regeln von elektrischen Motoren, elektrischen Generatoren, dynamoelektrischen Umformern / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen



    Micromachined Heat Sinks

    Bang, Christopher A. / Hyman, Daniel J. / Pan, Tao | SAE Technical Papers | 1999


    COMPONENT WITH A PLURALITY OF SEMICONDUCTOR CHIPS

    PETERSEN GUNNAR / REITH ANDREAS / RICHTER DANIEL | Europäisches Patentamt | 2024

    Freier Zugriff

    Micromachined Heat Sinks

    Bang, C. A. / Pan, T. / Hyman, D. J. et al. | British Library Conference Proceedings | 1999


    Designing heat pipe heat sinks

    ROBERTS, JR., C. | AIAA | 1975