The present technology relates to a solid-state image pickup element, electronic equipment, and a semiconductor apparatus that make it possible to reduce a surface reflection in an area in which a slit is formed and improve flare characteristics. A solid-state image pickup element includes a pixel area in which a plurality of pixels is two-dimensionally arranged in a matrix, a chip mounting area in which a chip is flip-chip mounted, and a dam area that is arranged around the chip mounting area and in which one or more slits that block an outflow of a resin are formed. In the dam area, the same OCL as that in the pixel area is formed. The present technology can be applied to a solid-state image pickup element etc. in which a chip is flip-chip mounted, for example.


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    Titel :

    Solid-state image pickup element, electronic equipment, and semiconductor apparatus


    Beteiligte:

    Erscheinungsdatum :

    16.05.2023


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / G05D SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES , Systeme zum Steuern oder Regeln nichtelektrischer veränderlicher Größen / A61B DIAGNOSIS , Diagnostik / H04N PICTORIAL COMMUNICATION, e.g. TELEVISION , Bildübertragung, z.B. Fernsehen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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