An assembly for mounting an electronics package to a tire includes an electronics package, a mount with a peripheral flange, and an attachment patch. The electronics package is connected to the mount, which is in contact with the tire. The attachment patch is connected to the mount and includes a central opening that it smaller than the peripheral flange. The attachment patch is further affixed to the tire.


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    Titel :

    Attachment mechanism for tire-mounted sensors


    Beteiligte:
    WEI TERENCE E (Autor:in) / SAMS THOMAS A (Autor:in)

    Erscheinungsdatum :

    2023-02-21


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B60C VEHICLE TYRES , Fahrzeugreifen / B29D PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE , Herstellen besonderer Gegenstände aus Kunststoff oder aus Stoffen in plastischem Zustand



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