A heat transfer system includes a first component formed of a thermally conductive material and a second component including a surface adapted to capture stray photons to provide heat to the electronic device. The first component is secured and thermally coupled with an electronic device. In particular, the first component includes first and second layers. The first component is in superposed relation with the second component.


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    Titel :

    Combined heat sink and photon harvestor


    Beteiligte:
    ANDERSON KEVIN (Autor:in)

    Erscheinungsdatum :

    18.02.2020


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    F28F Einzelheiten von Wärmetauschern oder Wärmeübertragungsvorrichtungen für allgemeine Verwendung , DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION / B64G Raumfahrt , COSMONAUTICS / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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