An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.


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    Titel :

    Multilayer stack with enhanced conductivity and stability


    Beteiligte:

    Erscheinungsdatum :

    2020-01-21


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01B CABLES , Kabel / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / H01C Widerstände , RESISTORS / H05B ELECTRIC HEATING , Elektrische Heizung



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