Inner partitions disposed within a cooling tank have an open space to form arrayed housing parts, and at least one unit of electronic device housed in each of the housing parts. A lifting mechanism includes a tower having a guide and a driving source for raising and lowering an arm, a slide mechanism attached to the cooling tank, and a stopper for restricting the tower's movement so that a range of the tower's motion in a width direction of the cooling tank does not exceed at least a width of the open space. The slide mechanism supports the tower movably with respect to the cooling tank in a horizontal plane located above the open space. The liquid immersion cooling system can safely lift or lower the electronic devices densely housed within the cooling tank without requiring the stage in the periphery of the installation surface of the cooling tank.


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    Titel :

    Liquid immersion cooling system


    Beteiligte:
    SAITO MOTOAKI (Autor:in)

    Erscheinungsdatum :

    03.09.2019


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    F28D Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen , HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT / B66D Haspeln , CAPSTANS / G06F ELECTRIC DIGITAL DATA PROCESSING , Elektrische digitale Datenverarbeitung / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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