A method of forming a solder composition comprises mixing indium, nickel, copper, silver, antimony, zinc, and tin together to form an alloy that consists of about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper. about 0.03% to about 4% by weight nickel, about 0.03% to about 1.5% by weight zinc, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The solder composition formed by this method can be used to solder an electrical connector to an electrical contact surface on a glass component.


    Zugriff

    Download


    Exportieren, teilen und zitieren



    Titel :

    Method of forming a lead-free solder composition


    Beteiligte:

    Erscheinungsdatum :

    2018-10-23


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B23K Löten , SOLDERING OR UNSOLDERING / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / C03C Chemische Zusammensetzungen für Gläser, Glasuren oder Emails , CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS / C22C Legierungen , ALLOYS / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



    METHOD OF FORMING A LEAD-FREE SOLDER COMPOSITION

    HWANG JENNIE S / PEREIRA JOHN / MACKIN ALEXANDRA MARY et al. | Europäisches Patentamt | 2018

    Freier Zugriff

    LEAD-FREE SOLDER COMPOSITION

    HWANG JENNIE S / PEREIRA JOHN / MACKIN ALEXANDRA MARY et al. | Europäisches Patentamt | 2017

    Freier Zugriff

    Lead-free solder composition

    HWANG JENNIE S / PEREIRA JOHN / MACKIN ALEXANDRA MARY et al. | Europäisches Patentamt | 2018

    Freier Zugriff

    Lead Free Solder for Automotive Electronics

    Whitten, G. / Society of Automotive Engineers | British Library Conference Proceedings | 1998


    LEAD-FREE SOLDER VALIDATION TEST PLAN

    SAE Technical Papers | 2020