A method for forming an assembly can include attaching one or more tacking pads (130) to one or both of a first surface (102) of a first subassembly (100) and a second surface (112) of a second subassembly (110). The method further includes dispensing an adhesive (140) onto at least one of the first and second surfaces. The first and second surfaces are placed in contact with the one or more tacking pads, thereby tacking the first and second subassemblies together, during which the first and second surfaces contact the adhesive, thereby decreasing a thickness and increasing a surface area of the adhesive. Subsequently, the adhesive is cured. The tacking pad(s) maintain fixed alignment of the subassemblies during curing of the adhesive, and establish a bond line of the adhesive.


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    Titel :

    ПРОЦЕСС СВЯЗЫВАНИЯ БЕЗ ПРИЛОЖЕНИЯ ДАВЛЕНИЯ ДЛЯ ПРИКРЕПЛЕНИЯ СОЛНЕЧНЫХ ЭЛЕМЕНТОВ К ПАНЕЛИ


    Erscheinungsdatum :

    27.07.2020


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Russisch


    Klassifikation :

    IPC:    B64C AEROPLANES , Flugzeuge