A subject described in the present specification relates to a system for dissipating heat from an electronic component that supports an autonomous vehicle system and a method thereof. In particular, the present specification describes how electronic components can be located in a duct into which conditioned cabin air can be drawn to convectively dissipate heat from the electronic components.

    본 명세서에서 기술된 주제는 자율 주행 차량 시스템을 지원하는 전자 컴포넌트로부터의 열을 소산시키기 위한 시스템 및 방법에 관한 것이다. 특히, 본 명세서는 전자 컴포넌트로부터의 열을 대류적으로 소산시키기 위해 공조된 캐빈 공기가 끌여들여질 수 있는 덕트에 전자 컴포넌트가 어떻게 위치될 수 있는지를 기술한다.


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    Titel :

    COOLING SOLUTIONS FOR AUTONOMOUS VEHICLES


    Weitere Titelangaben:

    자율 주행 차량의 냉각 솔루션


    Beteiligte:

    Erscheinungsdatum :

    2023-06-19


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Koreanisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60H ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING, OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODS SPACES OF VEHICLES , Anordnung oder Einbau der Heizung, Kühlung, Lüftung oder anderer Luftbehandlungsvorrichtungen für die Fahrzeugräume für Reisende oder Fracht



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